Smart device Brand | Laptop, Android, ZTE, Moto, Nokia, Meizu, Sony, Oppo, Vivo, XiaoMi, LG, One Plus, Huawei, Samsung, iPhone |
BGA reballing kit | Stencil |
Weight | 1.5 kg = 3.3069 lb = 52.9109 oz |
These templates were manufactured with high quality material, with the machine
can be heated by hot air, it is easy and fast to flip the BGA IC again.
Features:
They are made of high quality Stainless steel quality, the thickness of the steel mesh is perfect.
They can be heated with the hot air machine, these templates are not easy to deform when heated.
620 small direct heating template kits meet your diverse needs.
The specifications are marked on the surface, it is convenient that you choose.
It is specially designed for laptop, desktop, main communication board
north-south bridge, and graphics card, etc. All kinds of BGA chips.
Specification:
Stainless steel material: stainless steel
Silver color
Quantity: 620pcs
Weight: approximately 268g
List of packages:
3 pieces x templates BGA pieces for 0.35mm Welding Ball
2 pieces x templates BGA pieces for 0.4mm Welding Ball
7 pieces x BGA insoles for 0.45mm Welding Ball
35 pieces x templates BGA pieces for 0.5mm Solder Ball
60 pieces x BGA templates for 0.6mm Solder Ball
23 pieces x BGA templates for 0.76mm Welding Ball
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