- Origin: CN(Origin)
- Certification: None
- Model Number: MJ-501A/501B/503A/503B
- Particle Size: 20-38μm
- Size: 32*37.5mm
- Weight: .25kg
- Model Number: MJ-501A/501B/503A/503B
- Melting Point: 138℃/183℃
- Store: 2-10℃
- Feature 1: easy to tin
- Feature 2: not connected with tin
- Feature 3: environmental protection
- Feature 4: not walking
- Feature 5: High purity
- Feature 6: full solder joints
Mijing MJ-501A/501B/503A/503B 183℃/138 Medium/Low Temperature Tin Paste For Motherboard BGA Chips Soldering Reballing material
Features:
1.Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
2.Good soldering and welding tool
3.Advanced insulation technology, a high viscosity no-clean flux, it can be used for PCB, SMD reworking, as well as reballing of computer and phone chips.
4.The mixture of high-quality alloyed powder and resinic pasty flux, which avoid the pale yellow residue, so you are easy to clean the board.
5.Super compacity: Soldering paste for cell phone PCB, SMD, PGA and computer etc.
6.Help to repair the circuit boards and protect the electronic components
7.Flux Solder Paste – no clean soldering
8.Syringe solder paste is an ideal assistant for phone motherboard and repairing cell phone surface mount assemblies.
9.The syringe plunger will provide premium activity levels with maximum wetting and spreading, 10cc syringe is available for all rework soldering and desoldering repairs.
10.High quality, perfect performance, easy to weld.
11.Suitable for mobile phone repair industry, computer digital service industry, high-precision circuit board SMD welding, BGA welding technology and so on.
Application:
Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
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