- Model Number: XGS40 XGS60 Solder paste
- Particle Size: 20-38μm
- Melting Point: 158 Degree
MECHANIC Solder Paste Flux for CPU A8 A9 A10 A11 Low Temperature 153 Degress Non Clean Welding Fulx BGA Welding Tools
Feature:
Microns : 20-38um
Low Temperature Melting Point : 158°
Great Soldering Tin Cream for iPhone CPU A8 A9 A10 A11
The welding spot is bright, full and good weldability,suitable for superior continuous pringing.
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