- Brand Name: MECHANIC
- Origin: CN(Origin)
- Certification: NONE
- Model Number: X-Max
- Use range: Mobile phone middle frame, back cover, bracket bonding
- Initial fixation time: 10 minutes
- Capacity: 50ML
- Model: X-Max
- Color: transparent/black
- Convenient to use: needle cap
- Rapid positioning: Strong adhesion
- Repair scope: Special glue for mobile phone repair
MECHANIC 50ml X-Max PP Structural Adhesive Phone Touch Screen Middle Frame Rear Cover Bracket Glass Repair Strong Bonding Glue
$2.34
SKU:
23423532
Categories: Hot Brands, Mechanic, Solder Paste and Flux, Soldering Tools, Tools and Supplies
Tag: NeedleCap Glue
Description
Reviews (0)
Be the first to review “MECHANIC 50ml X-Max PP Structural Adhesive Phone Touch Screen Middle Frame Rear Cover Bracket Glass Repair Strong Bonding Glue” Cancel reply
Youtube Channel
Related products
MJ 3D BGA Reballing Stencil Template Groove for iPhone 11 Pro Max XS MAX X 8 7 6S 6 Plus A8 A9 A10 A11 A12 A13 CPU RAM chip
Cordless Electric Screwdriver Set 20 Pcs S2 Bit Rechargeable Screw Driver Kit for Phone Laptop PC Household Repair
$20.00
MaAnt T1 Universal PCB Holder High Temperature Resistance IC Chip Motherboard Jig Board Phone Circuit Board Nand CPU Clamp
$15.80
Qianli iSocket for Phone 11Pro Max 11pro 11 XSMAX XS Motherboard Upper and Lower Testing Fixture Function Tester
$86.51
AMAOE BGA Reballing Template Stencil HW15 For Huawei Mate40Pro 40RS Kirin 9000 Hi36A0 CPU RAM Tin Plate Net Steel Mesh 0.12MM
$2.50
BGA Reballing Stencil Template for samsung S6/S7/S8 S9 S10 S20 A520 A310 A9 C9 C710/J610 J1/J2/J4 A10-A70 A60-A90
$2.50
Qianli iCopy S 4 in 1 Logic Baseband EEPROM IC Chip Programmer EEPROM IC Read Write Repair for 6 6S X XS XSMAX Without Soldering
Amaoe BGA Reballing Stencil CPU IC For Huawei 20Plus 20Pro Nova8se X10Max 7pro Chip Reball Solder Tin Plant Net Steel Mesh
$2.50
Reviews
There are no reviews yet.