SUGON 2020D 700W Hot Air Gun Soldering Station 110/220V Lead Free Rework Station Phone PCB Chip Repair BGA SMD Soldering Station
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Aviso:
Para los usuarios de la Unión Europea, el precio de almacén español ya incluye el impuesto adicional, y no es necesario pagar el impuesto al recibir la mercancía.
Parameter:
Model: SUGON 2020D
Category: LED microcomputer digital display
Power consumption: 700 w
Airflow type: brushless fan soft wind
Gas flow rate: 100 litres/minute.
Temperature control range: 100 ° C – 500 ° C / 212℉-932℉
Display form: LED digital (resolution 1 ° C)
Handle component length: 120 cm
Noise: less than 45 db
Package list :
1 x SUGON 2020D
1 x Power Cable
1 x Handle
2 x Cyclone nozzle (7mm,9mm)
3 x Straight nozzle (4mm,7mm,9mm)
1 x Manual
The characteristics
1, sensors, closed circuit, the zero passage trigger temperature control of the microcomputer, LED display, big power, heating is rapid, accurate and stable temperature, not affected by the air volume, truly lead-free desoldering.
2, adjustable air flow, air volume big and soft wind, temperature control is convenient, can be suitable for a variety of purposes.
3, the handle is equipped with induction switch, as long as the hand shake hands handle, the system can quickly enter the working mode; Handle is released into the handle frame, the system will enter the standby mode, easy to operate in real time.
4, the system is equipped with automatic air cooling function, can prolong the life of heating element and protect the heat gun.
5, adopts brushless fan very long life, small noise, using high quality heating element under the same power efficiency can be doubled, and can effectively prolong the working life of the heating element and power saving.
6, the machine is equipped with safety protection function.
7.Celsius and Fahrenheit temperature conversion.
8.Calibration temperature function
If the heating element is replaced, the temperature must be recalibrated. This machine uses
Use digital temperature calibration method to correct the incremental key input, easy and quick to adjust
Applicable Use:
Desoldering is suitable for a variety of components, such as: SOIC, CHIP, QFP, PLCC, BGA (especially suitable for mobile phone line and row line of desoldering); Used for heat shrinkable, drying, in addition to the paint, in addition to the glue, thawing, preheating, welding, etc.
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