AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU Steel Mesh 0.12MM
$2.35
Weight: 0.04kg
Description
Additional information
Weight | 0.04 kg |
---|
Reviews (0)
Be the first to review “AMAOE QU:5 Qualcomm CPU reballing stencil 0.12MM SDM845 SM8150 SDM670 SDM710 MSM8917 SM6150 QU5 CPU Steel Mesh 0.12MM” Cancel reply
Youtube Channel
Related products
Qianli iSocket for Phone X XS XSMAX Logic Board Function Diagnostic Quick Tester Phone Repair Quality Motherboard Test Fixture
Metal Soldering Wire Stand Holder Tin Wire Frame BGA Soldering Station Rework Tools
$1.45
RELIFE RL-405 Solder paste for jump wire CPU Motherboard/Logic board soldering tail charger repair for iphone x xs 11 pro max
$1.98
MJ 3D BGA Reballing Stencil Template Groove for iPhone 11 Pro Max XS MAX X 8 7 6S 6 Plus A8 A9 A10 A11 A12 A13 CPU RAM chip
QianLi iTor Screwdriver High Presion 3D Batch Magnetic Screwdriver Ket for Samsung Phone iPad Repair Tool
MaAnt M12 M11 M10 For iPhone X-11 Pro Max 12 Mini 12 Pro MAX Motherboard Layering Tester Logic Board Mid-Frame Test Fixture
Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Template Net
$2.50
Reviews
There are no reviews yet.