- Origin: CN(Origin)
- Certification: NONE
- Model Number: Solder Ball
- Particle Size: 1-10μm
- Balls League: Sn63 / Pb37
- Standard: RoHs Available & SGS Tested
- Quantity: 25,000 PCS per Bottle
- Feature 1: Reballing Balls
- Feature 2: Welding Fluxes
- Feature 3: Solder Ball
- Feature 4: Tin Material
- Feature 5: Rework Repair Tools
1 bottles BGA Reballing Balls (0.25mm,0.3mm,0.35mm,0.4mm,0.45mm,0.5mm,0.55mm,0.6mm,0.65mm) BGA Leaded Soldering Ball For Bga Repair Tools
Brand new and high quality.
Solder (Tin) Balls is the best choice of reballing IC.
It is used instead of the pin in the IC component package structure.
Condition: Brand New
Balls League: Sn63 / Pb37
Standard: RoHs Available & SGS Tested
Size: 0.25mm,0.3mm,0.35mm,0.4mm,0.45mm,0.5mm,0.55mm,0.6mm,0.65mm
Quantity: 25,000 PCS per Bottle
Package Include:25000pcs/bottle
Notice:
1.1cm=10mm=0.39inch.
2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.
3.Please understand that colors may exist chromatic aberration as the different placement of pictures.
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