AMAOE EMMC EMCP Font BGA Chip Reballing Stencil 0.15MM Steel Mesh For BGA153/162/169/186/221/254
$2.35
Weight: 0.04kg
Description
Additional information
Weight | 0.04 kg |
---|
Reviews (0)
Be the first to review “AMAOE EMMC EMCP Font BGA Chip Reballing Stencil 0.15MM Steel Mesh For BGA153/162/169/186/221/254” Cancel reply
Youtube Channel
Related products
AMAOE Middle Layer BGA Reballing Stencil Tin Planting Soldering Net For SAMSUNG S10 5G G977 G977B Phone Repair Tool
$2.50
RELIFE RL-405 Solder paste for jump wire CPU Motherboard/Logic board soldering tail charger repair for iphone x xs 11 pro max
$1.98
Metal Soldering Wire Stand Holder Tin Wire Frame BGA Soldering Station Rework Tools
$1.45
Amaoe BGA Stencil For iphone 12 Pro Max Mini-IC ChipTin Net Planting Template BGA Reballing Tools 0.12MM
$2.50
Qianli iSocket for Phone 11Pro Max 11pro 11 XSMAX XS Motherboard Upper and Lower Testing Fixture Function Tester
$86.51
AMAOE LCD: 2 For iPhone 6S-XS Max 12 LCD display IC face tail infrared camera original color chip BGA Stencil Reballing
$2.50
Reviews
There are no reviews yet.