BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz
|
AMAOE Middle Layer Camera motherboard Reballing Stencil Template For Huawei Honor Magic 3 Pro Magic3Pro Solder Tin Planting Net
$2.36
SKU:
2056087
Categories: BGA Stencil, Tools and Supplies
Tags: AMAOE, BGA reballing kit, Huawei Honor Magic 3 Pro, Magic 3 Pro, motherboard, Phone repair tools, Solder Tin, stencil
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