Full BGA Reballing Stencil Template for Huawei Series Mate 10/20/30/40 Nova 2S/5/6/7/8SE P8/9/10/20/30/40
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MECHANIC LEF100 100ml lead-free rosin flux no-clean welding paste for SMT BGA chip circuit board mobile phone tablet repair $6.31

BGA Reballing Stencil Template MQ1 2 3For MTK CPU SDM710 /845/MT6771/6739/6763 MT6779V/6768/6765/SDM439/ SM8250 /7250/SM7150 /SM6150

$2.50

Weight: 0.1kg

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