- Origin: CN(Origin)
- Certification: NONE
- Model Number: XG30/XGSP30/XG40/XGSP40/XG50/XGSP50/XGSP80/XGZ40
- Particle Size: 20-38μm
- Melting Point: 183℃
- Type: Soldering tin paste
- Sn Content: 63.0%
- Pb Content: 37.0%
- Feature: No-clean
- Stored Temperature: 0-10℃
- Gross Weight: About 16.0-60.0g / pcs
- Application: For industrial use only
- Paste: IPX3
- Scope of application: mobile phone repair BGA tin planting, etc.
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