- Model Number: MJ-501 Solder paste
- Particle Size: 25-48μm
- Feature: Soldering Solder Welding Paste
- Melting point mj-501: 183 degrees
- Melting point mj-503: 138 degrees
MJ-501 Solder Paste High Purity Welding Flux for BGA NAND IC Chip Reballing SMT SMD Welding Paste
Features:
1.With advanced insulation technology, it is easy to dry and strong sticky.
Moist, high purity, easy to weld, solder bright and unconnected tin.
2.The residue was colorless and transparent, does not affect the excellent detection, disposable and clean.
3.Good soldering and welding tool
Maybe it will look like mud (as shown) during the bumpy transportation, but it’s a normal situation and will not affect the use.
4.MJ-501A /MJ-501B Melting Point is 183℃ /MJ-503A /MJ-504B Melting Point is 138℃
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