MJ K21 Motherboard PCB Fixture for iPhone X XS MAX Circuit Board BGA Chips Positioning Soldering Desoldering Reballing Platform

MJ K21 for iPhone Motherboard Fixture for iphone X XS MAX Circuit Board BGA chips positioning / soldering / desoldering / reballing repair platform, multifunctional for iPhone PCB Holder for iPhone X/XS/XS MAX, high temperature resistant motherboard repair platform will offer the best assistance to professional for iphone fix holder.

MJ K21 for iphone X XS MAX Motherboard Fixture Cooling Soldering PCB Holder

Features:

1. MJ K21 PCB repair platform uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell for phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage,  pure copper heat conduction block does not directly contact the main board

2. MJ K21 PCB repair platform added CPU positioning structure. No manual positioning needed, improve the success rate.

3. MJ K21 PCB repair platform designed with integrated layer tin planting function. The precision stencils are produced by world’s leading laser technology.

4.MJ K21 PCB repair platform added motherboard layer separation and positioning installation structure.

5. Designed with precision positioning column, it will makes efficient repairs for separating, soldering and installation.

6. Pure copper heat conduction material are dealt with special process so that surface color will keep new.

7.Apply imported synthetic stone materials, a number of testing and improved precision processing with 500 degree high temperature direct heating, durable and no deformation