- Origin: CN(Origin)
- Certification: CE
- Certification: None
- Model Number: BGA Reballing Kit
- Particle Size: 1-10μm
- Usage: Qianli BGA Reballing Fixture
- Application: Middle Layer Board Repairing for iPhone X /XS/XS MAX
- Size: Motherboard Middle Layer Planting Tin Platform
- Function: BGA Reballing for iPhone 11/11 Pro/11 Pro MAX
- Usage 2: BGA Reballing for iPhone 12/12Pro/12ProMax/12Mini
Qianli BGA Reballing Stencil Kit for iPhone X XS XS MAX 11 Pro 12 Motherboard Middle Frame Planting Tin Reballing Platform
SKU:
1005003312147106
Categories: Accessories, QianLi
Description
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