Relife RL-601Q BGA Reballing Stencil For Iphone X XS XSMAX 11 11PRO PROMAX Middle Layer

Relife RL-601Q BGA Reballing Stencil For Iphone X XS XSMAX 11 11PRO PROMAX Middle Layer

0.12MSIM Isolation tin coverPrevent the motherboard from getting tin on the SIM card holder when the motherboard is tin-planting

Silicone non-slip foot pads. specific weighted iron plate at the bottomSilicone anti-slip foot pads are used at the bottom to effectively isolate the temperature. anti-skid and anti-scald. so that the tin planting position is more stable

RELIFEHigh hardness thick synthetic stoneThe main body adopts special synthetic stone material. high temperature resistance and fast heat dissipation

Features :

Ultra-thin design: Excellent bonding of tin planting

Super Hard: High-quality imported steel

Supper accurate: Original data + physical comparison

Ultra thin: Precise hole position

Tiptop: Rhombus cooling hole + strip cooling line

Precision BGA Stencils

Custom bottom

Iron plate to increase weight

Make tin planting more stable

More precise. good heat dissipation

Suitable for IP X-11 series

High temperature resistant steel material

Constant bending. full of toughness

Imported steel. round and square precise hole positions. make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.

Relife RL-601Q BGA Reballing Stencil For Iphone X XS XSMAX 11 11PRO PROMAX Middle LayerSupplier

From Oriwhiz. you can get high-quality and affordable price repair tools for cellphone/laptop/computer repair of Hand Tools. Soldering Tools. Programming Tools. BGA Stencil. Testing & Power Supply. Organizer. Microscope. Lamps. Multimeter. Hot Air Heat Station. etc.

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If you are looking for repair tools Relife RL-601Q BGA Reballing Stencil For Iphone X XS XSMAX 11 11PRO PROMAX Middle Layer.feel free to tell us the first time. we will offer you a professional explanation and satisfactory solutions. to make more comfortable for your maintenance process to provide convenience.