TBK R2201 Infrared Laser Desoldering Machine For Mobile Phone Motherboard Short-Circuit Rapid Check Disassemble Repair

Intelligent Thermal Infrared Imager Analyzer BGA Rework Station Built-in Laser Heating De-soldering with Microscope for iPhone

New TBK-R2201 intelligent thermal imaging laser welding machine advantages:

1)Thermal imaging and high-definition diagnostic function-Automatic detection of positive and negative pole thermal imaging mainboard connection. When the power supply temperature is too high, you can notice it.

2)Precise constant temperature control on laser heating;

3)Low power consumption (55W ) but fast heating;

4)No thermal radiation, no influence on working ambient temperature;

5)Space heating solder,;

6)Easy to operate for chip maintenance!

7)Aviation grade all aluminum fuselage (net weight is only 6.2 Kg)

Voltage:110V-220V

Power:100W
Laser power:55W
heating temperature:100-450℃
microscope:4KCCD
pixel: (4800million)

Machine size:290*290*340mm
Wooden box size:425*355*325mm

net weight:6.2KG
Gross weight:8.4KG

TBK-R2201 intelligent infrared laser desoldering machine is equipped with 256 high-definition thermal imager, 4K high-definition electron microscope, 55W laser machine, intelligent constant temperature control system, the temperature can be set to a constant temperature of 100-450 degrees, and can be used for desoldering, chip, glue removal, planting Tin, flying wire and other work, small size, light weight, long life, no consumables.