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AMAOE Yi repair / LPDDR5 / tin planting network / LPDDR5 K3LKBKB0BM / memory flash chip / steel mesh $3.11

AMAOE Middle Layer Camera motherboard Reballing Stencil Template For Huawei Honor Magic 3 Pro Magic3Pro Solder Tin Planting Net

$2.36

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SKU: 2056087 Categories: , Tags: , , , , , , ,
Description
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz

 
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