View cart “AMAOE LCD: 2 For iPhone 6S-XS Max 12 LCD display IC face tail infrared camera original color chip BGA Stencil Reballing” has been added to your cart.
Amaoe/Q888 Reballing Stencil/Qualcomm Snapdragon 888CPU/Upper/Lower/Steel Mesh Stencil
$2.51
Weight: 0.04kg
Description
Additional information
Weight | 0.04 kg |
---|
Reviews (0)
Be the first to review “Amaoe/Q888 Reballing Stencil/Qualcomm Snapdragon 888CPU/Upper/Lower/Steel Mesh Stencil” Cancel reply
Youtube Channel
Related products
Phone Rear Glass Fixing Mould LCD Screen Refurbishing Pressure Mould Fixture
$12.10
Qianli iSocket for Phone X XS XSMAX Logic Board Function Diagnostic Quick Tester Phone Repair Quality Motherboard Test Fixture
For Samsung Note 10 N976V/N975U Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin BGA Reball Stencil Solder Template
$2.50
MaAnt M12 M11 M10 For iPhone X-11 Pro Max 12 Mini 12 Pro MAX Motherboard Layering Tester Logic Board Mid-Frame Test Fixture
BGA Reballing Stencil Template for samsung S6/S7/S8 S9 S10 S20 A520 A310 A9 C9 C710/J610 J1/J2/J4 A10-A70 A60-A90
$2.50
Amaoe BGA Stencil For iphone 12 Pro Max Mini-IC ChipTin Net Planting Template BGA Reballing Tools 0.12MM
$2.50
Reviews
There are no reviews yet.