AMAOE Middle Layer Camera motherboard Reballing Stencil Template For Huawei Honor Magic 3 Pro Magic3Pro Solder Tin Planting Net $2.36
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AMAOE OFix-B Phone Universal Fixture Mainboard Rear Shell Fixed Repair Clip Glue Removal Dismantle Patform $15.39

AMAOE Yi repair / LPDDR5 / tin planting network / LPDDR5 K3LKBKB0BM / memory flash chip / steel mesh

$3.11

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SKU: 2056079 Categories: , Tags: , , , , , , ,
Description
BGA reballing kit Stencil
Weight 0.04 kg = 0.0882 lb = 1.4110 oz
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