Weight | 0.04 kg |
---|---|
Dimensions | 12 × 10 × 2 cm |
View cart “Phone Rear Glass Fixing Mould LCD Screen Refurbishing Pressure Mould Fixture” has been added to your cart.
Applicable to Samsung ZFlip3 5G middle layer tin planting mesh SM-F711U/B/N/0/D/W Amao
$2.16
Weight: 0.04kg
SKU:
LS2179515
Categories: Tools and Supplies, BGA Stencil
Additional information
Reviews (0)
Be the first to review “Applicable to Samsung ZFlip3 5G middle layer tin planting mesh SM-F711U/B/N/0/D/W Amao” Cancel reply
Youtube Channel
Related products
AMAOE Middle Layer BGA Reballing Stencil Tin Planting Soldering Net For SAMSUNG S10 5G G977 G977B Phone Repair Tool
$2.50
MaAnt T1 Universal PCB Holder High Temperature Resistance IC Chip Motherboard Jig Board Phone Circuit Board Nand CPU Clamp
$15.80
Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Template Net
$2.50
For Samsung Note 10 N976V/N975U Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin BGA Reball Stencil Solder Template
$2.50
AMAOE BGA Stencil Planting Tin Net For iphone 6/6P/6SP/7P/8P/XR/MAX/IP11 A8-A13 CPU Multi-PURPOSE Stencil Solder Template
$2.50
Reviews
There are no reviews yet.