AMAOE Chip BGA Reballing Stencil For cell phone Amplifier RF ic chips HI6D05 78191-11 $2.50
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Middle layer reballing stencil Platform kits for Xiaomi Redmi K30Pro $67.13

BGA reball Stencil Template For MTK CPU MT6795W /6797W/6595/3732/6750/ MT6582/6735/6589/6572A/6580A/6755 MT6853/MT6885/6891/6769

Weight: 0.1kg

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SKU: 1005003475212389 Categories: ,
Description

 

  • Origin: CN(Origin)
  • Certification: CE
  • Model Number: MU 1-4

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Additional information
Weight 0.1 kg
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