- Brand Name: MECHANIC
- Origin: CN(Origin)
- Certification: NONE
- Model Number: X-Max
- Use range: Mobile phone middle frame, back cover, bracket bonding
- Initial fixation time: 10 minutes
- Capacity: 50ML
- Model: X-Max
- Color: transparent/black
- Convenient to use: needle cap
- Rapid positioning: Strong adhesion
- Repair scope: Special glue for mobile phone repair
View cart “Phone Rear Glass Fixing Mould LCD Screen Refurbishing Pressure Mould Fixture” has been added to your cart.
MECHANIC 50ml X-Max PP Structural Adhesive Phone Touch Screen Middle Frame Rear Cover Bracket Glass Repair Strong Bonding Glue
$2.34
SKU:
23423532
Categories: Hot Brands, Mechanic, Solder Paste and Flux, Soldering Tools, Tools and Supplies
Tag: NeedleCap Glue
Description
Reviews (0)
Be the first to review “MECHANIC 50ml X-Max PP Structural Adhesive Phone Touch Screen Middle Frame Rear Cover Bracket Glass Repair Strong Bonding Glue” Cancel reply
Youtube Channel
Related products
Qianli iCopy S 4 in 1 Logic Baseband EEPROM IC Chip Programmer EEPROM IC Read Write Repair for 6 6S X XS XSMAX Without Soldering
Amaoe BGA Reballing Stencil CPU IC For Huawei 20Plus 20Pro Nova8se X10Max 7pro Chip Reball Solder Tin Plant Net Steel Mesh
$2.50
MaAnt T1 Universal PCB Holder High Temperature Resistance IC Chip Motherboard Jig Board Phone Circuit Board Nand CPU Clamp
$15.80
AMAOE BGA Reballing Template Stencil HW15 For Huawei Mate40Pro 40RS Kirin 9000 Hi36A0 CPU RAM Tin Plate Net Steel Mesh 0.12MM
$2.50
RELIFE RL-405 Solder paste for jump wire CPU Motherboard/Logic board soldering tail charger repair for iphone x xs 11 pro max
$1.98
For Samsung Note 10 N976V/N975U Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin BGA Reball Stencil Solder Template
$2.50
Qianli iSocket for Phone X XS XSMAX Logic Board Function Diagnostic Quick Tester Phone Repair Quality Motherboard Test Fixture
AMAOE BGA Stencil Planting Tin Net For iphone 6/6P/6SP/7P/8P/XR/MAX/IP11 A8-A13 CPU Multi-PURPOSE Stencil Solder Template
$2.50
Reviews
There are no reviews yet.