View cart “Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Template Net” has been added to your cart.
Model Number: for iphone x xs 11 Particle Size: 1-10μm Model Number: For iphoneX BGA Reballing Application: For iphoneX Circuit Board Application1: Repair mainboard
Type: Hand Tool Parts Brand name: QIANLI MEGA IDEA MODEL: FOR X XS XSMAX 11 11PRO 11PRO MAX Features: Layered motherboard test [xlmodel]-[photo]-[0000]
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