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AMAOE Chip BGA Reballing Stencil For cell phone Amplifier RF ic chips HI6D05 78191-11 $2.50

MECHANIC Lead-Free Solder Tin Paste 217 High Temperature Melting Point Welding Flux Sn99/Ag0.3/Cu0.7 Soldering Paste CPU Repair

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SKU: 1005003308952703 Categories: ,
Description
  • Origin: CN(Origin)
  • Certification: CE
  • Model Number: M004
  • Particle Size: 25-48μm
  • Model: V4S35 / V3S35 / V5S35 / V8S35
  • Type: Soldering Tin Paste
  • Melting Point: 217℃
  • Sn Content: 99.0%
  • Cu Content: 0.70%
  • Ag Content: 0.30%
  • Stored Temperature: 0-10℃
  • Application: For industrial use only
  • Net Weight: About 20.0-60.0g / pcs

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