- Brand Name: welsolo
- Certification: CE
- Origin: CN(Origin)
- Application: Solder for soldering
- Melting Point: 210
- Material: Tin
- Diameter: 0.3/0.4/0.5/0.6/0.8mm
- Model Number: HBD366
- Weight: 40g
- Flux Content: 1%-10%
View cart “BGA Reballing Stencil Template for samsung S6/S7/S8 S9 S10 S20 A520 A310 A9 C9 C710/J610 J1/J2/J4 A10-A70 A60-A90” has been added to your cart.
MECHANIC Repairman lead-free solder wire HBD-366 0.3/0.4/0.5/0.6/0.8mm 40g / 100g / 180g / 400g
SKU:
mcsw 177-1
Categories: Hot Brands, Mechanic, Solder Paste and Flux, Soldering Tools, Tools and Supplies
Tag: Solder Wire
Description
Additional information
Model |
HBD-366 [40g] 0.4MM |
---|
Reviews (0)
Be the first to review “MECHANIC Repairman lead-free solder wire HBD-366 0.3/0.4/0.5/0.6/0.8mm 40g / 100g / 180g / 400g” Cancel reply
Youtube Channel
Related products
AMAOE Middle Layer BGA Reballing Stencil Tin Planting Soldering Net For SAMSUNG S10 5G G977 G977B Phone Repair Tool
$2.50
MJ 3D BGA Reballing Stencil Template Groove for iPhone 11 Pro Max XS MAX X 8 7 6S 6 Plus A8 A9 A10 A11 A12 A13 CPU RAM chip
AMAOE BGA Reballing Stencil Template For Iphone 6 6S/ 7 8 X XS /MAX /XR 11 11PRO/MAX 12/13 12/13Pro Max
$2.50
Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Template Net
$2.50
Amaoe BGA Stencil For iphone 12 Pro Max Mini-IC ChipTin Net Planting Template BGA Reballing Tools 0.12MM
$2.50
Cordless Electric Screwdriver Set 20 Pcs S2 Bit Rechargeable Screw Driver Kit for Phone Laptop PC Household Repair
$20.00
Amaoe BGA Reballing Stencil for Samsung S10 Note Middle Layer G977N G977B N975 Motherboard Repair Stencil
$2.50
Reviews
There are no reviews yet.