- Origin: CN(Origin)
- Certification: CE
- Certification: None
- Model Number: BGA Reballing Kit
- Particle Size: 1-10μm
- Usage: Qianli BGA Reballing Fixture
- Application: Middle Layer Board Repairing for iPhone X /XS/XS MAX
- Size: Motherboard Middle Layer Planting Tin Platform
- Function: BGA Reballing for iPhone 11/11 Pro/11 Pro MAX
- Usage 2: BGA Reballing for iPhone 12/12Pro/12ProMax/12Mini
View cart “Qianli IDFU Cable Charging Brushing Data Transmission Line For iPhone 12 Pro Max IOS Quick Enter Recovery Mode Reinstall System” has been added to your cart.
Qianli BGA Reballing Stencil Kit for iPhone X XS XS MAX 11 Pro 12 Motherboard Middle Frame Planting Tin Reballing Platform
SKU:
1005003312147106
Categories: Accessories, QianLi
Description
Reviews (0)
Be the first to review “Qianli BGA Reballing Stencil Kit for iPhone X XS XS MAX 11 Pro 12 Motherboard Middle Frame Planting Tin Reballing Platform” Cancel reply
Youtube Channel
Related products
Qianli iPinch IC Chip Motherboard Fixture Universal Temperature Resistant Mainboard Holder Turnable Glue Removal Double Axis Too
$31.61
Qianli Mega-IDEA Separator 3 IN 1 Pre-Heating Station Desoldering Platform for iPhone X XS MAX 11 Pro Max Motherboard Teardown
QianLi iTor Screwdriver High Presion 3D Batch Magnetic Screwdriver Ket for Samsung Phone iPad Repair Tool
Qianli iSocket for Phone X XS XSMAX Logic Board Function Diagnostic Quick Tester Phone Repair Quality Motherboard Test Fixture
Qianli Desoldering Platform for iPhone X XS 11 Pro Max Motherboard Fixture CPU Hard Disk Glue Removal Holder Repair Tools
$50.51
Qianli iHilt 012 Handle Low Center of Gravity Aluminum Alloy Blade Head Anti Skid Wear Resistance IC Chip Phone Repair Tools
Qianli Universal Dot Matrix Repair Fixture for X XS XSMAX 11 11pro Max Face ID Front Camera Repair Holder With Intelligent Light
$18.43
Qianli Hot Stone Preheating Platform Constant Temperature BGA Glue Removing Station for iPhone A13/A12/A11/A10 CPU Chip Removal
$17.00
Reviews
There are no reviews yet.