- Origin: CN(Origin)
- Certification: CE
- Certification: None
- Model Number: BGA Reballing Kit
- Particle Size: 1-10μm
- Usage: Qianli BGA Reballing Fixture
- Application: Middle Layer Board Repairing for iPhone X /XS/XS MAX
- Size: Motherboard Middle Layer Planting Tin Platform
- Function: BGA Reballing for iPhone 11/11 Pro/11 Pro MAX
- Usage 2: BGA Reballing for iPhone 12/12Pro/12ProMax/12Mini
View cart “Qianli Hot Stone Preheating Platform Constant Temperature BGA Glue Removing Station for iPhone A13/A12/A11/A10 CPU Chip Removal” has been added to your cart.
Qianli BGA Reballing Stencil Kit for iPhone X XS XS MAX 11 Pro 12 Motherboard Middle Frame Planting Tin Reballing Platform
SKU:
1005003312147106
Categories: Accessories, QianLi
Description
Reviews (0)
Be the first to review “Qianli BGA Reballing Stencil Kit for iPhone X XS XS MAX 11 Pro 12 Motherboard Middle Frame Planting Tin Reballing Platform” Cancel reply
Youtube Channel
Related products
Qianli BGA Reballing Stencil Planting Tin Platform for iPhone X XS 11 11Pro Max Motherboard Middle Layer Fixture
Qianli iCopy Plus LCD Screen True Tone Repair Programmer for Phone 11 Pro Max XR XSMAX XS 8P 8 7P 7 Vibration/Touch Repair
Qianli Ineezy Tweezers Hand Polished Non-Magnetic Stainless Steel Tweezer
$5.56
Qianli Desoldering Platform for iPhone X XS 11 Pro Max Motherboard Fixture CPU Hard Disk Glue Removal Holder Repair Tools
$50.51
Qianli RD-02 Mainboard Desoldering Platform for X/XS/11 PRO MAX 6 In 1 IC Chip Clamping CPU Hand Disk Glue Removal Holder
$27.18
Qianli 6in1 fixture best quality Precision fixing clamp for iphone x xs xsmax 11 pro max Motherboard chip Repair planting tin
$33.02
Reviews
There are no reviews yet.