Reballing stencil for Samsung S9 and S9+. Qualcomm 845 and Exynos9810 CPU universal series.
View cart “MaAnt T1 Universal PCB Holder High Temperature Resistance IC Chip Motherboard Jig Board Phone Circuit Board Nand CPU Clamp” has been added to your cart.
Qianli Bumblebee Stencil Samsung s9 / S9+ (Qualcomm 845 / Exynos9810) (QS43)
$5.95
SKU:
062BCA7EED
Categories: BGA Stencil, QianLi, Tools and Supplies
Description
Reviews (0)
Be the first to review “Qianli Bumblebee Stencil Samsung s9 / S9+ (Qualcomm 845 / Exynos9810) (QS43)” Cancel reply
Youtube Channel
Related products
For Samsung Note 10 N976V/N975U Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin BGA Reball Stencil Solder Template
$2.50
MaAnt M12 M11 M10 For iPhone X-11 Pro Max 12 Mini 12 Pro MAX Motherboard Layering Tester Logic Board Mid-Frame Test Fixture
Qianli iSocket for Phone X XS XSMAX Logic Board Function Diagnostic Quick Tester Phone Repair Quality Motherboard Test Fixture
MJ 3D BGA Reballing Stencil Template Groove for iPhone 11 Pro Max XS MAX X 8 7 6S 6 Plus A8 A9 A10 A11 A12 A13 CPU RAM chip
AMAOE BGA Reballing Stencil Template For Iphone 6 6S/ 7 8 X XS /MAX /XR 11 11PRO/MAX 12/13 12/13Pro Max
$2.50
Amaoe MQ3 BGA Reballing Stencil for Qualcomm 865 SM8250 7250 SM7150 SM6150 MT6885Z CPU RAM Tin Planting Template Net
$2.50
BGA Reballing Stencil Template for samsung S6/S7/S8 S9 S10 S20 A520 A310 A9 C9 C710/J610 J1/J2/J4 A10-A70 A60-A90
$2.50
Phone Rear Glass Fixing Mould LCD Screen Refurbishing Pressure Mould Fixture
$12.10
Reviews
There are no reviews yet.