Features:
1. Motherboard PCB fixture. CPU NAND PCIE glue remove. fingerprint repair fxture Multi-Function in one
2. Uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard. apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage. pure copper heat conduction block does not directly contact the main board
3. PCB repair platform added CPU positioning structure. No manual positioning needed. improve the success rate.
4. PCB repair platform designed with integrated layer tin planting function. The precision stencils are produced by world’s leading laser technology.
5. PCB repair platform added motherboard layer separation and positioning installation structure.
6. Designed with precision positioning column. it will makes efficient repairs for separating. soldering and installation.
7. Pure copper heat conduction material are dealt with special process so that surface color will keep new.
8. Precise snap design. do not hurt the motherboard
WYLIE Motherboard Fixture B68+ B72 B75 IC Chip CPU Soldering Platform For iP 6/6P/6S/6SP/7/7P/8/8P/XR/X/XS/XSM/11PRO MAX Repair
Description
Additional information
| Options |
B68+, B72, B75 |
|---|
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