- Origin: CN(Origin)
- Certification: CE
- Certification: None
- Model Number: BGA Reballing Kit
- Particle Size: 1-10μm
- Usage: Qianli BGA Reballing Fixture
- Application: Middle Layer Board Repairing for iPhone X /XS/XS MAX
- Size: Motherboard Middle Layer Planting Tin Platform
- Function: BGA Reballing for iPhone 11/11 Pro/11 Pro MAX
- Usage 2: BGA Reballing for iPhone 12/12Pro/12ProMax/12Mini
View cart “Qianli iPinch IC Chip Motherboard Fixture Universal Temperature Resistant Mainboard Holder Turnable Glue Removal Double Axis Too” has been added to your cart.
Qianli BGA Reballing Stencil Kit for iPhone X XS XS MAX 11 Pro 12 Motherboard Middle Frame Planting Tin Reballing Platform
SKU:
1005003312147106
Categories: Accessories, QianLi
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